Inventor · disambiguated record
Hinoko Kurosawa
Also filed as: KUROSAWA HINOKO
3 granted patents·68 citations·filing 1987–1992
74Inventor score
Files withHITACHI LTD3
Top patents by PatentIndex Score
3 records- 0158US5309011AWafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1992·Granted May 3, 1994·24 cites·25 claims
- 0256US4928281ASemiconductor memoryHITACHI LTD·Filed 1987·Granted May 22, 1990·27 cites·13 claims
- 0350US5191224AWafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed thereinHITACHI LTD·Filed 1990·Granted Mar 2, 1993·17 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →