Inventor · disambiguated record
Tian Hu
Also filed as: HU TIAN · HU TIAN-BAO
9 granted patents·5 pending applications·29 citations·filing 2004–2024
84Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11CULTURE COM TECHNOLOGY MACAU LTD2NAT MARINE ENVIRONMENTAL MONITORING CT1
Top patents by PatentIndex Score
14 records- 0198US11289396B2Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·13 cites·20 claims
- 0297US12087654B2Sensing die encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·4 cites·20 claims
- 0397US11764124B2Sensing component encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·4 cites·20 claims
- 0490US11171098B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·7 cites·20 claims
- 0586US12494405B2Fabricating a sensing component encapsulated by an encapsulation layer with roughed surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 0684US11600592B2PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·1 cites·20 claims
- 0778US12068273B2PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0878US2024363574A1PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0960US2025218993A1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1056US2024113089A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1149US12171200B2Carbon sink enhancement method based on oyster-undaria pinnatifida integrated aquacultureNAT MARINE ENVIRONMENTAL MONITORING CT·Filed 2024·Granted Dec 24, 2024·0 cites·5 claims
- 1249US11121299B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 1334US2005156929A1Graphics rendering system and methodCULTURE COM TECHNOLOGY MACAU LTD·Filed 2005·Application pending·0 cites
- 1430US2006013265A1Bus architecture and data transmission method thereofCULTURE COM TECHNOLOGY MACAU LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →