Inventor · disambiguated record
Sung-Jun Im
Also filed as: IM SUNG JUN
8 granted patents·4 pending applications·72 citations·filing 2008–2016
86Inventor score
Top patents by PatentIndex Score
12 records- 0193US8455301B2Method of fabricating stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2011·Granted Jun 4, 2013·25 cites·26 claims
- 0289US9705041B2Light emitting device packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 11, 2017·12 cites·24 claims
- 0386US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 0484US8637969B2Stacked chips in a semiconductor packageLEE TEAK-HOON·Filed 2013·Granted Jan 28, 2014·7 cites·10 claims
- 0574US7800138B2Semiconductor device including thermally dissipating dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 21, 2010·13 cites·3 claims
- 0670US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 0768US9391250B2Electronic device package and package substrate for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 12, 2016·2 cites·18 claims
- 0860US9059149B2Electronic device package and packaging substrate for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 16, 2015·2 cites·13 claims
- 0959US2014377894A1Method of manufacturing semiconductor light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1055US2016126432A1Method of manufacturing semiconductor light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1149US2014339581A1Method of manufacturing semiconductor light emitting device packageKWON YONG MIN·Filed 2014·Application pending·0 cites
- 1232US2015243846A1Light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →