Inventor · disambiguated record
Raymond A. Jackson
Also filed as: JACKSON RAYMOND A · JACKSON RAYMOND ALAN
30 granted patents·909 citations·filing 1990–2001
98Inventor score
Files withIBM30
Top patents by PatentIndex Score
30 records- 0194US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0293US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0388US6458623B1Conductive adhesive interconnection with insulating polymer carrierIBM·Filed 2001·Granted Oct 1, 2002·45 cites·29 claims
- 0487US6335210B1Baseplate for chip burn-in and/of testing, and method thereofIBM·Filed 1999·Granted Jan 1, 2002·64 cites·13 claims
- 0586US6548175B2Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereofIBM·Filed 2001·Granted Apr 15, 2003·48 cites·15 claims
- 0682US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 0781US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 0879US5553766AIn-situ device removal for multi-chip modulesIBM·Filed 1994·Granted Sep 10, 1996·31 cites·20 claims
- 0976US6528352B1Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applicationsIBM·Filed 2001·Granted Mar 4, 2003·20 cites·20 claims
- 1075US6541305B2Single-melt enhanced reliability solder element interconnectIBM·Filed 2001·Granted Apr 1, 2003·23 cites·14 claims
- 1174US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 1274US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 1373US6719188B2Rework methods for lead BGA/CGAIBM·Filed 2001·Granted Apr 13, 2004·20 cites·6 claims
- 1470US6259155B1Polymer enhanced column grid arrayIBM·Filed 1999·Granted Jul 10, 2001·31 cites·22 claims
- 1568US6216937B1Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 1999·Granted Apr 17, 2001·31 cites·12 claims
- 1668US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 1768US5153408AMethod and structure for repairing electrical linesIBM·Filed 1990·Granted Oct 6, 1992·33 cites·44 claims
- 1867US6360938B2Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 2001·Granted Mar 26, 2002·12 cites·12 claims
- 1967US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 2067US5779133AIn-situ device removal for multi-chip modulesIBM·Filed 1996·Granted Jul 14, 1998·22 cites·19 claims
- 2160US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 2260US5605277AHot vacuum device removal process and apparatusIBM·Filed 1994·Granted Feb 25, 1997·18 cites·12 claims
- 2359US5446961AMethod for repairing semiconductor substratesIBM·Filed 1993·Granted Sep 5, 1995·26 cites·16 claims
- 2456US6497357B2Apparatus and method for removing interconnectionsIBM·Filed 2001·Granted Dec 24, 2002·8 cites·15 claims
- 2556US5543584AStructure for repairing electrical linesIBM·Filed 1992·Granted Aug 6, 1996·21 cites·24 claims
- 2656US5493076AStructure for repairing semiconductor substratesIBM·Filed 1995·Granted Feb 20, 1996·21 cites·13 claims
- 2755US6015955AReworkability solution for wirebound chips using high performance capacitorIBM·Filed 1997·Granted Jan 18, 2000·13 cites·11 claims
- 2852US5868304ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1996·Granted Feb 9, 1999·19 cites·9 claims
- 2936US6226863B1Reworkability method for wirebond chips using high performance capacitorIBM·Filed 1999·Granted May 8, 2001·4 cites·5 claims
- 3032US6070782ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1998·Granted Jun 6, 2000·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →