Inventor · disambiguated record
Giuseppe Marchisi
Also filed as: MARCHISI GIUSEPPE
17 granted patents·523 citations·filing 1979–1996
95Inventor score
Files withSGS THOMSON MICROELECTRONICS7ATES COMPONENTI ELETTRON3ST MICROELECTRONICS SRL3MARCHISI GIUSEPPE1SGS ANTES COMPONENTI ELETTRONI1
Top patents by PatentIndex Score
17 records- 0193USD264853SElectronic memory credit card with frangible portionSGS ATES COMPONENTI ELETTR S P A·Filed 1979·Granted Jun 8, 1982·55 cites·1 claims
- 0287US5034350ASemiconductor device package with dies mounted on both sides of the central pad of a metal frameSGS THOMSON MICROELECTRONICS·Filed 1990·Granted Jul 23, 1991·103 cites·3 claims
- 0380US5629574AControl interface device for an electric motorSGS THOMSON MICROELECTRONICS·Filed 1993·Granted May 13, 1997·48 cites·21 claims
- 0475US5763296AMethod for fabricating an electronic device structure with studs locating lead frame on backing plateST MICROELECTRONICS SRL·Filed 1994·Granted Jun 9, 1998·49 cites·3 claims
- 0570USRE37707ELeadframe with heat dissipator connected to S-shaped fingersST MICROELECTRONICS SRL·Filed 1996·Granted May 21, 2002·43 cites·39 claims
- 0668US6002173ASemiconductor device package with metal-polymer joint of controlled roughnessSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Dec 14, 1999·40 cites·19 claims
- 0766US5521439ACombination and method for coupling a heat sink to a semiconductor deviceSGS MICROELECTRONICS S R L·Filed 1994·Granted May 28, 1996·38 cites·17 claims
- 0865US5034800AHollow plastic package for semiconductor devicesSGS THOMSON MICROELECTRONICS·Filed 1989·Granted Jul 23, 1991·31 cites·4 claims
- 0963US5102828AMethod for manufacturing a semiconductor card with electrical contacts on both facesATES COMPONENTI ELETTRON·Filed 1989·Granted Apr 7, 1992·25 cites·7 claims
- 1055US5338971AElectronic device structure with studs locating lead frame on backing plateST MICROELECTRONICS SRL·Filed 1992·Granted Aug 16, 1994·22 cites·28 claims
- 1148US5244838AProcess and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power deviceSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Sep 14, 1993·16 cites·4 claims
- 1245US4649460ASingle-in-line integrated electronic componentATES COMPONENTI ELETTRON·Filed 1985·Granted Mar 10, 1987·12 cites·2 claims
- 1344US4467522AProcess for manufacturing plastic containers incorporating a heat disperser for integrated circuitsMARCHISI GIUSEPPE·Filed 1982·Granted Aug 28, 1984·13 cites·1 claims
- 1441US5370517AApparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power deviceSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Dec 6, 1994·11 cites·14 claims
- 1537US5113240ALeadframe with heat dissipator connected to s-shaped fingersSGS THOMSON MICROELECTRONICS·Filed 1991·Granted May 12, 1992·10 cites·8 claims
- 1635US5032894ASemiconductor card with electrical contacts on both facesATES COMPONENTI ELETTRON·Filed 1989·Granted Jul 16, 1991·5 cites·4 claims
- 1722US4711023AProcess for making single-in-line integrated electronic componentSGS ANTES COMPONENTI ELETTRONI·Filed 1986·Granted Dec 8, 1987·2 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →