Inventor · disambiguated record
Mao-Feng Hsu
Also filed as: HSU MAO-FENG
16 granted patents·12 pending applications·3 citations·filing 2005–2023
85Inventor score
Files withZHEN DING TECH CO LTD10AVARY HOLDING SHENZHEN CO LTD7JOU JWO-HUEI3DAIGIN CHEMICAL CO LTD1FUKUI PREC COMPONENT (SHENZHEN) CO LTD1
Top patents by PatentIndex Score
28 records- 0188US10894882B2Low dielectric resin composition, film and circuit board using the sameZHEN DING TECH CO LTD·Filed 2018·Granted Jan 19, 2021·2 cites·12 claims
- 0272US11261328B2Circuit board using low dielectric resin compositionZHEN DING TECH CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 0372US2024040687A1Circuit board assemblyAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 0471US12028967B2Method of manufacturing wiring substrateAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·9 claims
- 0568US10822522B2Modified polyimide compound, resin composition and polyimide filmZHEN DING TECH CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·9 claims
- 0667US9539849B2Hydraulic transfer film, pattern film, and method of forming a hydraulic transfer filmHSU MAO-FENG·Filed 2014·Granted Jan 10, 2017·1 cites·17 claims
- 0766US11825595B2Manufacturing method of circuit board assemblyAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·8 claims
- 0865US11696391B2Wiring substrate and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·15 claims
- 0961US10428238B2Resin composition, polyimide film and method for manufacturing polyimide filmZHEN DING TECH CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·5 claims
- 1057US10875984B2Inorganic shell, resin composition, and method for making inorganic shellZHEN DING TECH CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·18 claims
- 1152US2012061616A1Modified nano-dot, fabrication method thereof and composition element thereofJOU JWO-HUEI·Filed 2011·Application pending·0 cites
- 1251US11792914B2Circuit board assembly and manufacturing method thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·15 claims
- 1351US10501664B1Resin compositon, removable adhesive layer, IC substrate, and IC packaging processQI DING TECH QINHUANGDAO CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 1450US2010102294A1Organic light emitting diode with nano-dots and fabrication method thereofUNIV TSINGHUA·Filed 2009·Application pending·0 cites
- 1550US2010215875A1Thermal transfer-printing film and method utilizing the sameYANG CHING-CHANG·Filed 2009·Application pending·0 cites
- 1648US2010224832A1Modified nano-dot, fabrication method thereof and composition element thereofNAT UNIV TSING HUA·Filed 2010·Application pending·0 cites
- 1748US2022218048A1Clothing-type wearable fabric capable of adjusting temperature thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Application pending·0 cites
- 1847US2006079606A1Low dielectric constant substrateIND TECH RES INST·Filed 2005·Application pending·0 cites
- 1946US10423069B2Water soluble photosensitive resin composition and film using sameZHEN DING TECH CO LTD·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 2045US8216634B2High-molecule-based organic light-emitting diode and fabrication method thereofJOU JWO-HUEI·Filed 2009·Granted Jul 10, 2012·0 cites·8 claims
- 2143US2022124910A1Stretchable sensing structure and method for manufacturing stretchable sensing structureAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 2242US8334531B2High-molecule-based organic light-emitting diode and fabrication method thereofJOU JWO-HUEI·Filed 2011·Granted Dec 18, 2012·0 cites·8 claims
- 2341US10329368B2Photosensitive resin composition, and film and printed circuit board using sameZHEN DING TECH CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·17 claims
- 2436US2017275508A1Resin composition and adhesive film and circuit board made of the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Application pending·0 cites
- 2535US2018223048A1Resin composition, method for making resin composition and film for circuit board, and circuit boardZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 2632US9989919B2Method for forming a hydraulic transfer film, hydraulic transfer film, and patterned articleDAIGIN CHEMICAL CO LTD·Filed 2015·Granted Jun 5, 2018·0 cites·8 claims
- 2732US2017369653A1Polyamic acid, polyimide, polyimide film and copper clad laminate using the sameZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 2831US2018203350A1Photosensitive resin composition, method for making photosensitive resin composition, and method for making printed circuit board therewithZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →