Inventor · disambiguated record
Jeong-O Ha
Also filed as: HA JEONG OH · HA JEONG-O
7 granted patents·3 pending applications·43 citations·filing 2005–2023
82Inventor score
Top patents by PatentIndex Score
10 records- 0182US7541680B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·13 cites·9 claims
- 0280US8400779B2Semiconductor package having multi pitch ball landKIM TONG-SUK·Filed 2010·Granted Mar 19, 2013·6 cites·27 claims
- 0380US7723836B2Chip stack structure having shielding capability and system-in-package module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 25, 2010·18 cites·20 claims
- 0476US9171827B2Stack type semiconductor packageLEE JIN-HO·Filed 2014·Granted Oct 27, 2015·3 cites·15 claims
- 0573US8817486B2Semiconductor package having multi pitch ball landKIM TONG-SUK·Filed 2013·Granted Aug 26, 2014·3 cites·11 claims
- 0659US2024234275A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0752US7776650B2Method for fabricating a flip chip system in packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 17, 2010·0 cites·8 claims
- 0848US7517723B2Method for fabricating a flip chip system in packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·0 cites·20 claims
- 0943US2008211078A1Semiconductor packages and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1037US2006102992A1Multi-chip packageKWON HEUNG-KYU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →