Inventor · disambiguated record
Emiel De Bruin
Also filed as: DE BRUIN EMIEL
5 granted patents·15 citations·filing 2010–2015
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0179US9153529B2Pre-soldered leadless packageNXP BV·Filed 2014·Granted Oct 6, 2015·6 cites·5 claims
- 0272US8728929B2Pre-soldered leadless packageVAN KEMPEN JAN·Filed 2010·Granted May 20, 2014·6 cites·8 claims
- 0368US9324674B2Die substrate assembly and methodNXP BV·Filed 2014·Granted Apr 26, 2016·3 cites·9 claims
- 0449US8981566B2Discrete semiconductor device package and manufacturing methodNXP BV·Filed 2013·Granted Mar 17, 2015·0 cites·9 claims
- 0546US9263335B2Discrete semiconductor device package and manufacturing methodNXP BV·Filed 2015·Granted Feb 16, 2016·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →