Inventor · disambiguated record
Jan Van Kempen
Also filed as: VAN KEMPEN JAN
3 granted patents·18 citations·filing 2010–2014
67Inventor score
Top patents by PatentIndex Score
3 records- 0179US9153529B2Pre-soldered leadless packageNXP BV·Filed 2014·Granted Oct 6, 2015·6 cites·5 claims
- 0272US8728929B2Pre-soldered leadless packageVAN KEMPEN JAN·Filed 2010·Granted May 20, 2014·6 cites·8 claims
- 0368US8541786B2Packaged semiconductor device having improved locking propertiesBOOMEN RENE WILHELMUS JOHANNES MARIA VAN DEN·Filed 2011·Granted Sep 24, 2013·6 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →