Inventor · disambiguated record
Grant Wagner
Also filed as: WAGNER GRANT · WAGNER GRANT W
22 granted patents·6 pending applications·32 citations·filing 2010–2022
91Inventor score
Top patents by PatentIndex Score
28 records- 0193US8471575B2Methodologies and test configurations for testing thermal interface materialsFREGEAU DUSTIN·Filed 2010·Granted Jun 25, 2013·22 cites·15 claims
- 0287US10261108B2Low force wafer test probe with variable geometryIBM·Filed 2016·Granted Apr 16, 2019·3 cites·21 claims
- 0375US11322473B2Interconnect and tuning thereofIBM·Filed 2019·Granted May 3, 2022·2 cites·13 claims
- 0475US9797928B2Probe card assemblyIBM·Filed 2014·Granted Oct 24, 2017·2 cites·18 claims
- 0573US9116200B2Methodologies and test configurations for testing thermal interface materialsIBM·Filed 2013·Granted Aug 25, 2015·2 cites·19 claims
- 0670US11009545B2Integrated circuit tester probe contact linerIBM·Filed 2020·Granted May 18, 2021·0 cites·20 claims
- 0769US10670653B2Integrated circuit tester probe contact linerIBM·Filed 2018·Granted Jun 2, 2020·0 cites·16 claims
- 0868US12248003B2Clustered rigid wafer test probeIBM·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 0968US11085949B2Probe card assemblyIBM·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 1067US11029334B2Low force wafer test probeIBM·Filed 2019·Granted Jun 8, 2021·0 cites·10 claims
- 1166US11675010B1Compliant wafer probe assemblyIBM·Filed 2021·Granted Jun 13, 2023·0 cites·22 claims
- 1266US10663487B2Low force wafer test probe with variable geometryIBM·Filed 2019·Granted May 26, 2020·0 cites·21 claims
- 1362US8836356B2Vertical probe assembly with air channelAUDETTE DAVID M·Filed 2011·Granted Sep 16, 2014·1 cites·14 claims
- 1462US2018358323A1Pressing solder bumps to match probe profile during wafer level testingIBM·Filed 2017·Application pending·0 cites
- 1561US11041879B2Fluidized alignment of a semiconductor die to a test probeIBM·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 1661US10578648B2Probe card assemblyIBM·Filed 2017·Granted Mar 3, 2020·0 cites·20 claims
- 1759US11662366B2Wafer probe with elastomer supportIBM·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 1858US10444260B2Low force wafer test probeIBM·Filed 2016·Granted Oct 15, 2019·0 cites·23 claims
- 1956US2024213217A1Clustering fine pitch micro-bumps for packaging and testIBM·Filed 2022·Application pending·0 cites
- 2053US11131689B2Low-force wafer test probesIBM·Filed 2017·Granted Sep 28, 2021·0 cites·9 claims
- 2153US9086433B2Rigid probe with compliant characteristicsIBM·Filed 2012·Granted Jul 21, 2015·0 cites·15 claims
- 2253US9081034B2Rigid probe with compliant characteristicsIBM·Filed 2013·Granted Jul 14, 2015·0 cites·8 claims
- 2352US2019227100A1Processes for fabricating low-force wafer test probes and their structuresIBM·Filed 2019·Application pending·0 cites
- 2449US10955439B2Electrochemical cleaning of test probesIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2549US2018340959A1Processes for fabricating low-force wafer test probes and their structuresIBM·Filed 2018·Application pending·0 cites
- 2648US11561243B2Compliant organic substrate assembly for rigid probesIBM·Filed 2019·Granted Jan 24, 2023·0 cites·16 claims
- 2748US2018358322A1Pressing solder bumps to match probe profile during wafer level testingIBM·Filed 2017·Application pending·0 cites
- 2847US2018358321A1Pressing solder bumps to match probe profile during wafer level testingIBM·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →