Inventor · disambiguated record
Keita Kitade
Also filed as: KITADE KEITA
4 granted patents·1 pending application·19 citations·filing 2007–2009
70Inventor score
Top patents by PatentIndex Score
5 records- 0181US7795865B2Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereofTOKYO SEIMITSU CO LTD·Filed 2007·Granted Sep 14, 2010·8 cites·12 claims
- 0272US7830141B2Film thickness measuring apparatus and film thickness measuring methodTOKYO SEIMITSU CO LTD·Filed 2009·Granted Nov 9, 2010·7 cites·14 claims
- 0369US7821257B2Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thicknessTOKYO SEIMITSU CO LTD·Filed 2008·Granted Oct 26, 2010·4 cites·14 claims
- 0446US8173037B2Wafer polish monitoring method and deviceFUJITA TAKASHI·Filed 2008·Granted May 8, 2012·0 cites·11 claims
- 0544US2008156773A1End point detection method applying resonance phenomenon, end point detection apparatus, chemical mechanical polishing apparatus on which the detection apparatus is loaded, and semiconductor device fabricated by the chemical mechanical polishing apparatusTOKYO SEIMITSU CO LTD·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Keita Kitade files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →