Inventor · disambiguated record
Hideki Eifuku
Also filed as: EIFUKU HIDEKI
24 granted patents·2 pending applications·231 citations·filing 1996–2016
95Inventor score
Files withPANASONIC CORP11MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6PANASONIC IP MAN CO LTD3MOTOMURA KOJI2SAKAI TADAHIKO2
Top patents by PatentIndex Score
26 records- 0191US8434665B2Electronic component mounting system and electronic component mounting methodMOTOMURA KOJI·Filed 2010·Granted May 7, 2013·17 cites·3 claims
- 0282US6209196B1Method of mounting bumped electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 3, 2001·46 cites·22 claims
- 0381US7793413B2Method of mounting electronic componentsPANASONIC CORP·Filed 2006·Granted Sep 14, 2010·10 cites·4 claims
- 0480US10080298B2Circuit board interconnection structure and circuit board interconnection methodPANASONIC CORP·Filed 2014·Granted Sep 18, 2018·4 cites·10 claims
- 0578US7797822B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Sep 21, 2010·10 cites·2 claims
- 0675US9756728B2Component-mounted structurePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 5, 2017·4 cites·15 claims
- 0772US6179198B1Method of soldering bumped work by partially penetrating the oxide film covering the solder bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 30, 2001·41 cites·6 claims
- 0871US8034447B2Electronic components mounting adhesive and electronic components mounting structurePANASONIC CORP·Filed 2007·Granted Oct 11, 2011·5 cites·7 claims
- 0970US6000127AElectronic parts mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 14, 1999·38 cites·4 claims
- 1066US10034389B2Electric component mounting methodPANASONIC IP MAN CO LTD·Filed 2013·Granted Jul 24, 2018·2 cites·6 claims
- 1165US8188605B2Components joining method and components joining structureSAKAI TADAHIKO·Filed 2011·Granted May 29, 2012·2 cites·8 claims
- 1264US8148253B2Electronic component soldering structure and electronic component soldering methodOZONO MITSURU·Filed 2006·Granted Apr 3, 2012·4 cites·6 claims
- 1364US8025205B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Sep 27, 2011·3 cites·6 claims
- 1463US8018074B2Components joining method and components joining structurePANASONIC CORP·Filed 2007·Granted Sep 13, 2011·2 cites·5 claims
- 1563US7886432B2Electric components connecting methodPANASONIC CORP·Filed 2007·Granted Feb 15, 2011·3 cites·6 claims
- 1663US7845074B2Method for manufacturing electronic parts modulePANASONIC CORP·Filed 2009·Granted Dec 7, 2010·3 cites·7 claims
- 1758US9015932B2Connecting method of electronic componentSAKAI TADAHIKO·Filed 2007·Granted Apr 28, 2015·2 cites·5 claims
- 1857US5962925AMounting structure of electronic component having bumpsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 5, 1999·22 cites·7 claims
- 1953US9949380B2Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic componentPANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 17, 2018·1 cites·7 claims
- 2052US8851138B2Substrate backing device and substrate thermocompression-bonding deviceMARUO HIROKI·Filed 2011·Granted Oct 7, 2014·1 cites·10 claims
- 2149US9839143B2Electrode joining method, production method of electrode joined structurePANASONIC CORP·Filed 2013·Granted Dec 5, 2017·0 cites·8 claims
- 2247US2009161328A1Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 2347US2010327044A1Method for manufacturing electronic component modulePANASONIC CORP·Filed 2009·Application pending·0 cites
- 2445US7841081B2Method for manufacturing electronic parts modulePANASONIC CORP·Filed 2009·Granted Nov 30, 2010·0 cites·4 claims
- 2543US5749510ASemiconductor chip bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted May 12, 1998·11 cites·14 claims
- 2642US8817487B2Electronic component mounting system and electronic component mounting methodMOTOMURA KOJI·Filed 2010·Granted Aug 26, 2014·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →