Inventor · disambiguated record
Meng-Tsang Lee
Also filed as: LEE MENG-TSANG
3 granted patents·8 citations·filing 2002–2002
58Inventor score
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0153US6627481B2Method of manufacturing a semiconductor package with a lead frame having a support structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Sep 30, 2003·7 cites·2 claims
- 0249US6942478B2Packaging mold with electrostatic discharge protectionADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Sep 13, 2005·1 cites·3 claims
- 0334US6777793B2Packaging substrate with electrostatic discharge protectionADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Aug 17, 2004·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →