Inventor · disambiguated record

Owai H. Low

Also filed as: LOW OWAI H

3 granted patents·123 citations·filing 1998–2003

70Inventor score

Technology areasH10W

Files withLSI LOGIC CORP3

Top patents by PatentIndex Score

3 records

0188US6002169AThermally enhanced tape ball grid array packageLSI LOGIC CORP·Filed 1998·Granted Dec 14, 1999·114 cites·9 claims
0260US6670214B1Insulated bonding wire for microelectronic packagingLSI LOGIC CORP·Filed 2000·Granted Dec 30, 2003·9 cites·14 claims
0339US6991147B2Insulated bonding wire tool for microelectronic packagingLSI LOGIC CORP·Filed 2003·Granted Jan 31, 2006·0 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →