Inventor · disambiguated record
Takeshi Kagamida
Also filed as: KAGAMIDA TAKESHI
8 granted patents·199 citations·filing 1993–1998
88Inventor score
Files withTOKYO SEIMITSU CO LTD8
Top patents by PatentIndex Score
8 records- 0189US5658189AGrinding apparatus for wafer edgeTOKYO SEIMITSU CO LTD·Filed 1995·Granted Aug 19, 1997·103 cites·6 claims
- 0262US5609514AWafer chamfering machineTOKYO SEIMITSU CO LTD·Filed 1994·Granted Mar 11, 1997·32 cites·9 claims
- 0359US5427644AMethod of manufacturing semiconductor wafer and system thereforTOKYO SEIMITSU CO LTD·Filed 1993·Granted Jun 27, 1995·33 cites·13 claims
- 0445US5555091AWafer diameter/sectional shape measuring machineTOKYO SEIMITSU CO LTD·Filed 1995·Granted Sep 10, 1996·13 cites·9 claims
- 0543US5582536AApparatus and method for manufacturing waferTOKYO SEIMITSU CO LTD·Filed 1995·Granted Dec 10, 1996·11 cites·8 claims
- 0636US5759344AWafer slicer base peeling systemTOKYO SEIMITSU CO LTD·Filed 1997·Granted Jun 2, 1998·4 cites·2 claims
- 0732US5849147AWafer slice base peeling systemTOKYO SEIMITSU CO LTD·Filed 1998·Granted Dec 15, 1998·2 cites·2 claims
- 0830US5853533AWafer slice base peeling systemTOKYO SEIMITSU CO LTD·Filed 1998·Granted Dec 29, 1998·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →