Inventor · disambiguated record
Maiden Grace Maming
Also filed as: MAMING MAIDEN GRACE
8 granted patents·4 citations·filing 2017–2023
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0186US11404355B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0276US12170240B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0373US10763194B2Package with lead frame with improved lead design for discrete electrical components and manufacturing the sameST MICROELECTRONICS INC·Filed 2017·Granted Sep 1, 2020·2 cites·20 claims
- 0469US12074100B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 0569US11664239B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2021·Granted May 30, 2023·0 cites·12 claims
- 0668US12159820B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 0759US11037864B2Lead frame for improving adhesive fillets on semiconductor die cornersST MICROELECTRONICS INC·Filed 2019·Granted Jun 15, 2021·0 cites·18 claims
- 0854US10892212B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2017·Granted Jan 12, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →