Inventor · disambiguated record
Ang-Ying Lin
Also filed as: LIN ANG-YING
9 granted patents·8 citations·filing 2019–2023
79Inventor score
Files withIND TECH RES INST9
Top patents by PatentIndex Score
9 records- 0187US11424190B2Multi-chip package and manufacture method thereofIND TECH RES INST·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0286US11251174B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 15, 2022·2 cites·16 claims
- 0382US12027470B2Package carrier having a stiffener between solder bumpsIND TECH RES INST·Filed 2021·Granted Jul 2, 2024·1 cites·20 claims
- 0481US11004816B2Hetero-integrated structureIND TECH RES INST·Filed 2019·Granted May 11, 2021·3 cites·19 claims
- 0570US11569217B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 31, 2023·0 cites·3 claims
- 0667US12074137B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2023·Granted Aug 27, 2024·0 cites·11 claims
- 0758US11587905B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 21, 2023·0 cites·8 claims
- 0854US11646270B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 0952US12009341B2Integrated antenna package structureIND TECH RES INST·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Ang-Ying Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →