Inventor · disambiguated record
Shih-Yi Lee
Also filed as: LEE SHIH-YI
10 granted patents·1 pending application·9 citations·filing 2011–2020
80Inventor score
Top patents by PatentIndex Score
11 records- 0180US9543233B2Chip package having a dual through hole redistribution layer structureXINTEC INC·Filed 2015·Granted Jan 10, 2017·3 cites·9 claims
- 0275US9640405B2Chip package having a laser stop structureXINTEC INC·Filed 2015·Granted May 2, 2017·2 cites·10 claims
- 0374US8791768B2Capacitive coupler packaging structureYIU HO-YIN·Filed 2012·Granted Jul 29, 2014·4 cites·20 claims
- 0450US9780050B2Method of fabricating chip package with laserXINTEC INC·Filed 2016·Granted Oct 3, 2017·0 cites·9 claims
- 0549US9768067B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Sep 19, 2017·0 cites·9 claims
- 0642US11938272B2Respiratory maskMACKAY MEMORIAL HOSPITAL·Filed 2020·Granted Mar 26, 2024·0 cites·11 claims
- 0742US9831185B2Chip package and fabrication method thereofXINTEC INC·Filed 2016·Granted Nov 28, 2017·0 cites·20 claims
- 0838US9853074B2Chip scale sensing chip packageXINTEC INC·Filed 2017·Granted Dec 26, 2017·0 cites·10 claims
- 0938US9721911B2Chip package and manufacturing method thereofXINTEC INC·Filed 2015·Granted Aug 1, 2017·0 cites·22 claims
- 1038US8614488B2Chip package and method for forming the sameWEN YING-NAN·Filed 2011·Granted Dec 24, 2013·0 cites·20 claims
- 1135US2016204061A1Chip package and fabrication method thereofXINTEC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →