Inventor · disambiguated record
Nitesh Kumbhat
Also filed as: KUMBHAT NITESH
10 granted patents·6 pending applications·75 citations·filing 2010–2023
85Inventor score
Files withAVAGO TECHNOLOGIES GENERAL IP9RAJ PULUGURTHA MARKONDEYA2APPLE INC1AVAGO TECH INT SALES PTE LID1GEORGIA TECH RES INST1
Top patents by PatentIndex Score
16 records- 0193US8536695B2Chip-last embedded interconnect structuresLIU FUHAN·Filed 2012·Granted Sep 17, 2013·57 cites·26 claims
- 0280US10827617B2Printed circuit board with cavityAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 3, 2020·3 cites·20 claims
- 0380US10134682B2Circuit package with segmented external shield to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Nov 20, 2018·4 cites·15 claims
- 0476US8970036B2Stress relieving second level interconnect structures and methods of making the sameRAJ PULUGURTHA MARKONDEYA·Filed 2011·Granted Mar 3, 2015·6 cites·7 claims
- 0561US10163808B2Module with embedded side shield structures and method of fabricating the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Dec 25, 2018·1 cites·10 claims
- 0659US9974181B2Module with external shield and back-spill barrier for protecting contact padsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 0756US9173282B2Interconnect structures and methods of making the sameRAJ PULUGURTHA MARKONDEYA·Filed 2011·Granted Oct 27, 2015·1 cites·11 claims
- 0856US8633601B2Interconnect assemblies and methods of making and using sameKUMBHAT NITESH·Filed 2010·Granted Jan 21, 2014·2 cites·19 claims
- 0954US2024074066A1Transfer molding systems for semiconductor device packagingAPPLE INC·Filed 2023·Application pending·0 cites
- 1042US2014347157A1Magnetic device utilizing nanocomposite films layered with adhesivesGEORGIA TECH RES INST·Filed 2012·Application pending·0 cites
- 1137US9907169B1Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCBAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Feb 27, 2018·0 cites·22 claims
- 1236US10021790B2Module with internal wire fence shieldingAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jul 10, 2018·0 cites·13 claims
- 1333US2017062352A1Semiconductor chip moduleAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 1433US2017117229A1Circuit package with trench features to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 1533US2017213785A1Method of forming solder bumps on solid state module including printed cirucuit boardAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
- 1632US2017118877A1Circuit package with bond wires to provide internal shielding between electronic componentsAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →