Inventor · disambiguated record
Hong T. Lim
Also filed as: LIM HONG T · LIM HONG TEE
5 granted patents·1 pending application·89 citations·filing 2001–2004
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0181US7420809B2Heat spreader in integrated circuit packageLSI CORP·Filed 2004·Granted Sep 2, 2008·33 cites·15 claims
- 0278US6897555B1Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit dieLSI LOGIC CORP·Filed 2003·Granted May 24, 2005·32 cites·26 claims
- 0360US6687133B1Ground plane on 2 layer PBGALSI LOGIC CORP·Filed 2002·Granted Feb 3, 2004·11 cites·3 claims
- 0454US6555914B1Integrated circuit package viaLSI LOGIC CORP·Filed 2001·Granted Apr 29, 2003·7 cites·14 claims
- 0553US7235889B2Integrated heatspreader for use in wire bonded ball grid array semiconductor packagesLSI CORP·Filed 2004·Granted Jun 26, 2007·6 cites·11 claims
- 0634US2006043587A1Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packagesLSI LOGIC CORP A DELAWARE CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →