Inventor · disambiguated record
Shigeki Kishiro
Also filed as: KISHIRO SHIGEKI
7 granted patents·5 pending applications·80 citations·filing 1996–2011
84Inventor score
Top patents by PatentIndex Score
12 records- 0177US6057413APropylene-ethylene random copolymer filmSUMITOMO CHEMICAL CO·Filed 1996·Granted May 2, 2000·35 cites·3 claims
- 0276US6624247B2Low temperature heat-sealable polypropylene-based filmSUMITOMO CHEMICAL CO·Filed 2001·Granted Sep 23, 2003·16 cites·9 claims
- 0372US6512050B2Polypropylene resin composition, T die film made of the same and method of producing T die filmSUMITOMO CHEMICAL CO·Filed 2001·Granted Jan 28, 2003·16 cites·5 claims
- 0466US6573332B2Propylene-based copolymer, process for producing the same and film comprising the sameSUMITOMO CHEMICAL CO·Filed 2001·Granted Jun 3, 2003·7 cites·9 claims
- 0556US2010144974A1Polypropylene-based copolymer and film comprising the polypropylene-based copolymerSUMITOMO CHEMICAL CO·Filed 2009·Application pending·0 cites
- 0654US2009171030A1Polypropylene-based copolymer and film comprising the polypropylene-based copolymerSUMITOMO CHEMICAL CO·Filed 2008·Application pending·0 cites
- 0751US2009048404A1Polypropylene resin composition and oriented film thereofSUMITOMO CHEMICAL CO·Filed 2008·Application pending·0 cites
- 0849US8420743B2Propylene-based copolymer and film made of the sameIKEDA KENJI·Filed 2011·Granted Apr 16, 2013·0 cites·8 claims
- 0944US6593003B2Polypropylene resin composition, T die film made of the same and method of producing T die filmSUMITOMO CHEMICAL CO·Filed 2002·Granted Jul 15, 2003·2 cites·1 claims
- 1039US2002065342A1Polypropylene resin composition for metallized film and metallized film prepared therefromFiled 2001·Application pending·0 cites
- 1138US2001041761A1Polypropylene resin composition, and molded article and film prepared therefromFiled 2001·Application pending·0 cites
- 1235US5726269APolypropylene filmSUMITOMO CHEMICAL CO·Filed 1996·Granted Mar 10, 1998·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →