Inventor · disambiguated record
Noboru Takeda
Also filed as: TAKEDA NOBORU
33 granted patents·9 pending applications·124 citations·filing 1987–2024
95Inventor score
Top patents by PatentIndex Score
42 records- 0190US9209591B2Laser processing methodDISCO CORP·Filed 2014·Granted Dec 8, 2015·10 cites·9 claims
- 0290US7446022B2Wafer laser processing methodDISCO CORP·Filed 2006·Granted Nov 4, 2008·15 cites·3 claims
- 0386US7557904B2Wafer holding mechanismDISCO CORP·Filed 2006·Granted Jul 7, 2009·12 cites·5 claims
- 0485US9517962B2Plate-shaped object processing methodDISCO CORP·Filed 2015·Granted Dec 13, 2016·3 cites·4 claims
- 0583US4847150AFoams of polyolefin/polystyrene resin mixtureASAHI CHEMICAL IND·Filed 1987·Granted Jul 11, 1989·37 cites·1 claims
- 0682US10119921B2Internal crack detecting method and internal crack detecting apparatusDISCO CORP·Filed 2017·Granted Nov 6, 2018·3 cites·15 claims
- 0782US9812362B2Wafer processing methodDISCO CORP·Filed 2017·Granted Nov 7, 2017·3 cites·4 claims
- 0882US9349646B2Wafer processing method including a filament forming step and an etching stepDISCO CORP·Filed 2014·Granted May 24, 2016·5 cites·8 claims
- 0981US10071442B2Laser processing apparatusDISCO CORP·Filed 2016·Granted Sep 11, 2018·3 cites·2 claims
- 1079US9761492B2Processing method of optical device waferDISCO CORP·Filed 2016·Granted Sep 12, 2017·3 cites·2 claims
- 1179US9537046B2Optical device wafer processing methodDISCO CORP·Filed 2014·Granted Jan 3, 2017·4 cites·2 claims
- 1277US9117895B2Laser processing methodDISCO CORP·Filed 2014·Granted Aug 25, 2015·3 cites·9 claims
- 1371US9305793B2Wafer processing methodDISCO CORP·Filed 2014·Granted Apr 5, 2016·2 cites·6 claims
- 1469US8258045B2Device processing methodMORIKAZU HIROSHI·Filed 2010·Granted Sep 4, 2012·2 cites·3 claims
- 1569US8252667B2Laser processing method for semiconductor waferMORIKAZU HIROSHI·Filed 2010·Granted Aug 28, 2012·2 cites·4 claims
- 1668US7642485B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jan 5, 2010·2 cites·1 claims
- 1767US8957347B2Method of detecting condensing spot position in laser beam processing apparatusYOSHIKAWA TOSHIYUKI·Filed 2012·Granted Feb 17, 2015·2 cites·1 claims
- 1862US7582541B2Wafer laser processing methodDISCO CORP·Filed 2007·Granted Sep 1, 2009·1 cites·2 claims
- 1958US2025140622A1Method of fixing protective memberDISCO CORP·Filed 2024·Application pending·0 cites
- 2055US12134577B2Manufacturing method of plate-shaped objectDISCO CORP·Filed 2021·Granted Nov 5, 2024·0 cites·3 claims
- 2153US2021347009A1Grinding apparatusDISCO CORP·Filed 2021·Application pending·0 cites
- 2250US6028121APre-expanded polyethylene beads and process for producing the same thereofASAHI CHEMICAL IND·Filed 1996·Granted Feb 22, 2000·12 cites·14 claims
- 2349US10923398B2Wafer processing methodDISCO CORP·Filed 2019·Granted Feb 16, 2021·0 cites·7 claims
- 2448US12194571B2Wafer forming methodDISCO CORP·Filed 2021·Granted Jan 14, 2025·0 cites·7 claims
- 2548US10780524B2Laser processing method and laser processing apparatusDISCO CORP·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
- 2648US9682440B2Chip manufacturing methodDISCO CORP·Filed 2015·Granted Jun 20, 2017·0 cites·4 claims
- 2747US10628933B2Inspecting apparatus and laser processing apparatusDISCO CORP·Filed 2017·Granted Apr 21, 2020·0 cites·9 claims
- 2846US2005242073A1Laser beam processing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 2946US2022241900A1Severing machineDISCO CORP·Filed 2022·Application pending·0 cites
- 3043US10809201B2Crystal orientation detecting apparatus and crystal orientation detecting methodDISCO CORP·Filed 2019·Granted Oct 20, 2020·0 cites·5 claims
- 3142US10553490B2Processing method for waferDISCO CORP·Filed 2018·Granted Feb 4, 2020·0 cites·14 claims
- 3242US9887140B2Wafer processing methodDISCO CORP·Filed 2017·Granted Feb 6, 2018·0 cites·4 claims
- 3342US2006079155A1Wafer grinding methodDISCO CORP·Filed 2005·Application pending·0 cites
- 3442US2013309844A1Laser beam processing method for waferDISCO CORP·Filed 2013·Application pending·0 cites
- 3541US11597040B2Laser processing apparatusDISCO CORP·Filed 2018·Granted Mar 7, 2023·0 cites·4 claims
- 3641US2006035411A1Laser processing methodDISCO CORP·Filed 2005·Application pending·0 cites
- 3738US9793166B2Lift-off methodDISCO CORP·Filed 2015·Granted Oct 17, 2017·0 cites·11 claims
- 3838US9735040B2Method of processing single-crystal substrateDISCO CORP·Filed 2016·Granted Aug 15, 2017·0 cites·15 claims
- 3938US2019217419A1Method of processing workpiece with laser beamDISCO CORP·Filed 2019·Application pending·0 cites
- 4036US10157793B2Method of processing single-crystal substrateDISCO CORP·Filed 2016·Granted Dec 18, 2018·0 cites·13 claims
- 4136US10103061B2Processing method of single-crystal substrateDISCO CORP·Filed 2016·Granted Oct 16, 2018·0 cites·19 claims
- 4233US2016172182A1Laser processing apparatusDISCO CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →