Inventor · disambiguated record
Scott Hinaga
Also filed as: HINAGA SCOTT · HINAGA SCOTT T
7 granted patents·2 pending applications·1 citations·filing 2011–2024
73Inventor score
Top patents by PatentIndex Score
9 records- 0180US11202368B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2020·Granted Dec 14, 2021·1 cites·19 claims
- 0278US12289831B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 0378US12160948B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 0473US11751322B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 0572US11706870B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 0668US11330702B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2020·Granted May 10, 2022·0 cites·17 claims
- 0754US2025151198A1Power method for higher current asic power deliveryCISCO TECH INC·Filed 2024·Application pending·0 cites
- 0836US2014119703A1Printed Circuit Board Comprising Both Conductive Metal and Optical ElementsCISCO TECH INC·Filed 2012·Application pending·0 cites
- 0932US8559678B2Method and apparatus for determining surface roughness of metal foil within printed circuitsHINAGA SCOTT T·Filed 2011·Granted Oct 15, 2013·0 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →