Inventor · disambiguated record
Yuan-Fu Ko
Also filed as: KO YUAN-FU
8 granted patents·1 pending application·21 citations·filing 2018–2024
78Inventor score
Files withUNITED MICROELECTRONICS CORP9
Top patents by PatentIndex Score
9 records- 0194US10204826B1Method for removing damaged layer embedded in a dielectric layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 12, 2019·20 cites·15 claims
- 0282US12057346B2Semiconductor device including metal interconnections having sidewall spacers thereon, and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 6, 2024·0 cites·7 claims
- 0381US2024347382A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0478US11791203B2Semiconductor device including metal interconnections having sidewall spacers thereon, and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 17, 2023·0 cites·7 claims
- 0573US10916427B2Forming contact holes using litho-etch-litho-etch approachUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 9, 2021·1 cites·9 claims
- 0662US11515159B2Forming contact holes using litho-etch-litho-etch approachUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 29, 2022·0 cites·10 claims
- 0761US11456207B2Semiconductor device including metal interconnections having sidewall spacers thereon, and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 27, 2022·0 cites·9 claims
- 0853US12007435B2Method of copper hillock detectingUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jun 11, 2024·0 cites·15 claims
- 0950US12334436B2Metal interconnect structure having serpent metal lineUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jun 17, 2025·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Yuan-Fu Ko files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →