Inventor · disambiguated record
Chien-Feng Chan
Also filed as: CHAN CHIEN-FENG
7 granted patents·5 pending applications·42 citations·filing 2006–2025
79Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD5ADVANCED SEMICONDUCTOR ENG2CHANG CHING SHIANG1CHEN YAN YU1COMPAL ELECTRONICS INC1
Top patents by PatentIndex Score
12 records- 0191US10936020B2Electronic device and expansion deviceCHANG CHING SHIANG·Filed 2019·Granted Mar 2, 2021·36 cites·26 claims
- 0274US8952537B2Conductive bump structure with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 10, 2015·3 cites·8 claims
- 0371US8952528B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 10, 2015·2 cites·11 claims
- 0465US9269693B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 23, 2016·1 cites·9 claims
- 0554US2025334146A1Electronic deviceCOMPAL ELECTRONICS INC·Filed 2025·Application pending·0 cites
- 0652US2007032273A1Accessory of a portable electronic deviceHSIAO FU-YUAN·Filed 2006·Application pending·0 cites
- 0749US11216030B2Portable electronic deviceCHEN YAN YU·Filed 2020·Granted Jan 4, 2022·0 cites·19 claims
- 0848US9349705B2Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layersSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 24, 2016·0 cites·15 claims
- 0944US11145621B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 12, 2021·0 cites·16 claims
- 1040US2014008819A1Substrate structure, semiconductor package and methods of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 1137US2020098700A1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 1229US2013256915A1Packaging substrate, semiconductor package and fabrication method thereofHUANG HUEI-NUAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →