Inventor · disambiguated record
Byeung Soo Song
Also filed as: SONG BYEUNG SOO
5 granted patents·6 citations·filing 2019–2022
65Inventor score
Files withMAGNACHIP SEMICONDUCTOR LTD5
Top patents by PatentIndex Score
5 records- 0183US10910270B2Method of forming and packaging semiconductor dieMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Feb 2, 2021·6 cites·12 claims
- 0268US11901322B2Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor dieMAGNACHIP SEMICONDUCTOR LTD·Filed 2022·Granted Feb 13, 2024·0 cites·10 claims
- 0359US11380640B2Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor dieMAGNACHIP SEMICONDUCTOR LTD·Filed 2020·Granted Jul 5, 2022·0 cites·14 claims
- 0450US12456651B2Semiconductor die forming and packaging method using ultrashort pulse laser micromachiningMAGNACHIP SEMICONDUCTOR LTD·Filed 2021·Granted Oct 28, 2025·0 cites·16 claims
- 0549US10741521B2Semiconductor package and method of manufacturing semiconductor packageMAGNACHIP SEMICONDUCTOR LTD·Filed 2019·Granted Aug 11, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →