Inventor · disambiguated record
Raul Mancera
Also filed as: MANCERA RAUL
4 granted patents·35 citations·filing 2007–2010
74Inventor score
Top patents by PatentIndex Score
4 records- 0182US7882628B2Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-viasINTEL CORP·Filed 2007·Granted Feb 8, 2011·13 cites·15 claims
- 0282US7841080B2Multi-chip packaging using an interposer with through-viasINTEL CORP·Filed 2007·Granted Nov 30, 2010·10 cites·8 claims
- 0378US7576434B2Wafer-level solder bumpsINTEL CORP·Filed 2007·Granted Aug 18, 2009·11 cites·14 claims
- 0460US8387240B2Methods for making multi-chip packaging using an interposerMUTHUKUMAR SRIRAM·Filed 2010·Granted Mar 5, 2013·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →