Inventor · disambiguated record
Kristin Schupke
Also filed as: SCHUPKE KRISTIN
11 granted patents·8 pending applications·71 citations·filing 2002–2012
88Inventor score
Top patents by PatentIndex Score
19 records- 0174US6740595B2Etch process for recessing polysilicon in trench structuresINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 25, 2004·16 cites·8 claims
- 0271US6734077B2Method for fabricating a trench capacitor for a semiconductor memoryINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 11, 2004·21 cites·28 claims
- 0367US7615444B2Method for forming a capacitor structureQIMONDA AG·Filed 2006·Granted Nov 10, 2009·4 cites·11 claims
- 0465US7863149B2Method for fabricating a capacitorQIMONDA AG·Filed 2005·Granted Jan 4, 2011·3 cites·21 claims
- 0559US7078748B2Multi-layer gate stack structure comprising a metal layer for a FET device, and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2004·Granted Jul 18, 2006·9 cites·15 claims
- 0654US7018781B2Method for fabricating a contact hole plane in a memory moduleINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 28, 2006·9 cites·29 claims
- 0754US7005723B2Bipolar transistor and method of producing sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 28, 2006·6 cites·17 claims
- 0845US6821863B2Method for producing a cavity in a monocrystalline silicon substrate and a semiconductor component having a cavity in a monocrystalline silicon substrate with an epitaxial covering layerINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 23, 2004·2 cites·11 claims
- 0941US7479461B2Method of etching silicon anisotropicallyINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 20, 2009·1 cites·3 claims
- 1041US2007141850A1Wet Treatment of Hafnium Containing MaterialsDUPONT AUDREY·Filed 2006·Application pending·0 cites
- 1138US2007012662A1Solution for wet treatment of hafnium containing materials, use of the solution and a wet treatment processDUPONT AUDREY·Filed 2005·Application pending·0 cites
- 1236US8835298B2NiSi rework procedure to remove platinum residualsKUMARASAMY SIVAKUMAR·Filed 2012·Granted Sep 16, 2014·0 cites·20 claims
- 1336US2008230839A1Method of producing a semiconductor structureREGUL JOERN·Filed 2007·Application pending·0 cites
- 1436US2007212849A1Method of fabricating a groove-like structure in a semiconductor deviceLUDWIG FRANK·Filed 2006·Application pending·0 cites
- 1535US2003114018A1Method for fabricating a semiconductor componentFiled 2002·Application pending·0 cites
- 1635US2008009139A1Structure in a substrate for the manufacturing of a semiconductor device and process for manufacturing of a semiconductor deviceHECHT THOMAS·Filed 2006·Application pending·0 cites
- 1734US8835318B2HNO3 single wafer clean process to strip nickel and for MOL post etchFITZ CLEMENS·Filed 2012·Granted Sep 16, 2014·0 cites·12 claims
- 1831US2005221620A1Process for etching a substrateHUANG TENG-WANG·Filed 2004·Application pending·0 cites
- 1928US2005191564A1Liner mask for semiconductor applicationsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →