Inventor · disambiguated record
Tatsuhiko Aoki
Also filed as: AOKI TATSUHIKO
11 granted patents·9 pending applications·34 citations·filing 2001–2024
83Inventor score
Files withGLOBALWAFERS JAPAN CO LTD7SENDA TAKESHI4AOKI TATSUHIKO3COVALENT MATERIALS CORP2TOYOTA STEEL CT CO LTD2
Top patents by PatentIndex Score
20 records- 0171US6808356B2Device for carrying article into and from container, method for introducing and discharging article into and from container, and pallet for carrying articleTOYOTA STEEL CT CO LTD·Filed 2001·Granted Oct 26, 2004·21 cites·17 claims
- 0267US2024393052A1Heat treatment apparatus, method of maintaining heat treatment apparatus, and method of regenerating lamp sleeveGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0363US8476149B2Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling processISOGAI HIROMICHI·Filed 2009·Granted Jul 2, 2013·3 cites·10 claims
- 0462US10141180B2Silicon wafer and method for manufacturing the sameGLOBALWAFERS JAPAN CO LTD·Filed 2014·Granted Nov 27, 2018·1 cites·3 claims
- 0559US7188816B2Pallet for coil-like transferred object, structural body for loading coil-like transferred object on pallet, structural body for storing coil-like transferred object loading pallet in container, and transferring methodTOYOTA STEEL CT CO LTD·Filed 2002·Granted Mar 13, 2007·9 cites·14 claims
- 0657US12371813B2Silicon wafer and method for producing silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·4 claims
- 0755US2006106684A1Cargo distribution management system, palette management system, and computer-readable storage medium and program used for themAOKI TATSUHIKO·Filed 2003·Application pending·0 cites
- 0850US2024304458A1Method for manufacturing silicon wafer and silicon waferGLOBAL WAFERS JAPAN CO LTD·Filed 2022·Application pending·0 cites
- 0945US2008237190A1Surface cleaning method of semiconductor wafer heat treatment boatCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 1043US2007065269A1Pallet for coiled carrying article, loading structure for loading coiled carrying article on pallet, stacking structure for stacking carrying article loading pallets and method for using the same, containing structure for containing stacked coiled carrying article loading pallets into transport receptacle and transport method therefor, and coiled carrying article transport methodAOKI TATSUHIKO·Filed 2003·Application pending·0 cites
- 1142US12488979B2Lamination wafers and method of producing bonded wafers using the sameGLOBALWAFERS JAPAN CO LTD·Filed 2020·Granted Dec 2, 2025·0 cites·3 claims
- 1241US8252700B2Method of heat treating silicon waferSENDA TAKESHI·Filed 2010·Granted Aug 28, 2012·0 cites·8 claims
- 1341US2008166891A1Heat treatment method for silicon waferCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 1439US8999864B2Silicon wafer and method for heat-treating silicon waferSENDA TAKESHI·Filed 2010·Granted Apr 7, 2015·0 cites·4 claims
- 1537US2013078588A1Method for heat-treating silicon waferSENDA TAKESHI·Filed 2012·Application pending·0 cites
- 1634US8399341B2Method for heat treating a silicon waferSENDA TAKESHI·Filed 2010·Granted Mar 19, 2013·0 cites·8 claims
- 1734US2016293446A1Method for manufacturing a silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2016·Application pending·0 cites
- 1833US12378695B2Method for heat-treating silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2019·Granted Aug 5, 2025·0 cites·4 claims
- 1933US10840089B2Protective-film forming method for semiconductor substrateGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Nov 17, 2020·0 cites·7 claims
- 2032US2006118529A1Laser cutting device, laser cutting method, and laser cutting systemAOKI TATSUHIKO·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →