Inventor · disambiguated record
Yusuke Kaji
Also filed as: KAJI YUSUKE
11 granted patents·3 pending applications·5 citations·filing 2016–2022
80Inventor score
Top patents by PatentIndex Score
14 records- 0185US11016428B1Image forming apparatus and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2020·Granted May 25, 2021·2 cites·8 claims
- 0269US9841700B2Image forming apparatusFUJI XEROX CO LTD·Filed 2016·Granted Dec 12, 2017·1 cites·9 claims
- 0366US11037844B2Power semiconductor device and method of manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 15, 2021·1 cites·10 claims
- 0462US11476170B2Power semiconductor module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 18, 2022·1 cites·17 claims
- 0554US10573570B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 25, 2020·0 cites·8 claims
- 0653US2023140664A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0752US11112741B2Image forming apparatus and non-transitory computer readable mediumFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Sep 7, 2021·0 cites·12 claims
- 0851US11837514B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 5, 2023·0 cites·19 claims
- 0944US11107756B2Semiconductor device and method for manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 31, 2021·0 cites·20 claims
- 1043US11482462B2Power semiconductor device with first and second sealing resins of different coefficient of thermal expansionMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 25, 2022·0 cites·10 claims
- 1139US12469802B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 11, 2025·0 cites·20 claims
- 1239US11031355B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jun 8, 2021·0 cites·10 claims
- 1339US2021391299A1Semiconductor device, method for manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Application pending·0 cites
- 1436US2021195066A1Image forming apparatus and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →