Inventor · disambiguated record

Hou-Ju Huang

Also filed as: HUANG HOU-JU

4 granted patents·2 pending applications·13 citations·filing 2013–2025

67Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD6

Top patents by PatentIndex Score

6 records

0189US9627346B2Underfill pattern with gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 18, 2017·12 cites·20 claims
0281US2025266356A1Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0379US12315806B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
0472US10867919B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
0569US11670593B2Package-on-package (POP) electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
0660US2025364393A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →