Inventor · disambiguated record
Ryosuke Kimoto
Also filed as: KIMOTO RYOSUKE · KOMOTO RYOSUKE
25 granted patents·2 pending applications·714 citations·filing 1992–2012
97Inventor score
Top patents by PatentIndex Score
27 records- 0195US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0295US6879041B2Semiconductor device with joint structure having lead-free solder layer over nickel layerRENESAS TECH CORP·Filed 2003·Granted Apr 12, 2005·87 cites·5 claims
- 0394US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0494US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0592US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 0692US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 0791US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 0891US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 0990US6476467B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2001·Granted Nov 5, 2002·56 cites·9 claims
- 1090US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 1186US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 1285US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 1385US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 1483US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 1579US6278176B1Semiconductor device and process for producing the sameHITACHI LTD·Filed 2000·Granted Aug 21, 2001·24 cites·11 claims
- 1672US7211892B2Semiconductor device having a particular electrode structureRENESAS TECH CORP·Filed 2005·Granted May 1, 2007·5 cites·7 claims
- 1771US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 1868US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 1967US7332800B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 19, 2008·15 cites·13 claims
- 2062US6355975B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·4 cites·15 claims
- 2162US6060770ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1998·Granted May 9, 2000·23 cites·5 claims
- 2260US7217645B2Method for manufacturing semiconductor device and electronic device and method for calculating connection conditionHITACHI LTD·Filed 2003·Granted May 15, 2007·8 cites·8 claims
- 2348US5869888ASemiconductor device with lead structure on principal surface of chipHITACHI LTD·Filed 1996·Granted Feb 9, 1999·12 cites·9 claims
- 2447US6146920ABump formation methodHITACHI LTD·Filed 1998·Granted Nov 14, 2000·11 cites·11 claims
- 2545US6400020B1Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacersHITACHI LTD·Filed 2000·Granted Jun 4, 2002·1 cites·13 claims
- 2643US2013067424A1Life prediction method of electronic device and design method of electronic device using the methodYAMAMOTO KENICHI·Filed 2012·Application pending·0 cites
- 2740US2004061220A1Semiconductor device and manufacturing method thereofFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →