Inventor · disambiguated record
Dosung Chun
Also filed as: CHUN DOSUNG
8 granted patents·672 citations·filing 2000–2004
91Inventor score
Top patents by PatentIndex Score
8 records- 0198US6395578B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·346 cites·35 claims
- 0296US6762078B2Semiconductor package having semiconductor chip within central aperture of substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 13, 2004·141 cites·15 claims
- 0389US6501184B1Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 31, 2002·58 cites·22 claims
- 0486US6525405B1Leadless semiconductor product packaging apparatus having a window lid and method for packagingALPHATEC HOLDING COMPANY LTD·Filed 2000·Granted Feb 25, 2003·43 cites·6 claims
- 0585US7061120B2Stackable semiconductor package having semiconductor chip within central through hole of substrateAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·33 cites·7 claims
- 0675US6830955B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·20 cites·12 claims
- 0769US6797541B2Leadless semiconductor product packaging apparatus having a window lid and method for packagingMILLENIUM MICROTECH CO LTD·Filed 2002·Granted Sep 28, 2004·15 cites·6 claims
- 0866US6512288B1Circuit board semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 28, 2003·16 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →