Inventor · disambiguated record
Seongoo Lee
Also filed as: LEE SEONGOO
9 granted patents·624 citations·filing 2000–2010
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0198US6395578B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·346 cites·35 claims
- 0296US6762078B2Semiconductor package having semiconductor chip within central aperture of substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 13, 2004·141 cites·15 claims
- 0389US6501184B1Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 31, 2002·58 cites·22 claims
- 0485US7061120B2Stackable semiconductor package having semiconductor chip within central through hole of substrateAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·33 cites·7 claims
- 0576US8044420B2Light emitting diode package structureADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Oct 25, 2011·8 cites·9 claims
- 0675US6830955B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·20 cites·12 claims
- 0766US6512288B1Circuit board semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 28, 2003·16 cites·18 claims
- 0859US8330178B2Package structure and package process of light emitting diodeJEONG HYUNSOO·Filed 2010·Granted Dec 11, 2012·2 cites·20 claims
- 0934US8450770B2Light emitting package structureJEONG HYUNSOO·Filed 2010·Granted May 28, 2013·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →