Inventor · disambiguated record
Takumi Asanuma
Also filed as: ASANUMA TAKUMI
13 granted patents·3 pending applications·35 citations·filing 2011–2025
86Inventor score
Top patents by PatentIndex Score
16 records- 0191US9023453B2Honeycomb structure and method for manufacturing honeycomb structureIDO TAKAHIKO·Filed 2011·Granted May 5, 2015·10 cites·29 claims
- 0289US8715579B2Honeycomb structureIDO TAKAHIKO·Filed 2011·Granted May 6, 2014·11 cites·18 claims
- 0388US8506894B2Honeycomb structural body and exhaust gas conversion apparatusIDO TAKAHIKO·Filed 2011·Granted Aug 13, 2013·10 cites·50 claims
- 0474US9758690B2Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying imageFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Sep 12, 2017·1 cites·8 claims
- 0568US8435455B2Honeycomb structural body and exhaust gas conversion apparatusIDO TAKAHIKO·Filed 2011·Granted May 7, 2013·2 cites·66 claims
- 0666US2025388784A1Semiconductor processing tapeFURUKAWA ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 0761US11845865B2Thermoplastic resin filmFURUKAWA ELECTRIC CO LTD·Filed 2020·Granted Dec 19, 2023·0 cites·14 claims
- 0860US10196547B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·1 cites·13 claims
- 0959US10988646B2Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the sameFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Apr 27, 2021·0 cites·4 claims
- 1050US10556974B2Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Feb 11, 2020·0 cites·6 claims
- 1145US10043996B2Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·17 claims
- 1242US10079360B2Resin composition for sealing electronic devices, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Sep 18, 2018·0 cites·9 claims
- 1341US10829669B2Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·7 claims
- 1441US2011250096A1Honeycomb structureIBIDEN CO LTD·Filed 2011·Application pending·0 cites
- 1535US10196534B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·13 claims
- 1632US2016017186A1Sealant composition and sealing sheet obtained from the compositionFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →