Inventor · disambiguated record
Masami Aoyama
Also filed as: AOYAMA MASAMI
10 granted patents·9 pending applications·5 citations·filing 2013–2018
79Inventor score
Files withFURUKAWA ELECTRIC CO LTD19
Top patents by PatentIndex Score
19 records- 0181US10563096B2Conductive adhesive compositionFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Feb 18, 2020·1 cites·16 claims
- 0274US9758690B2Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying imageFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Sep 12, 2017·1 cites·8 claims
- 0361US9631123B2Adhesive sheetFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Apr 25, 2017·1 cites·11 claims
- 0461US9523023B2Adhesive sheetFURUKAWA ELECTRIC CO LTD·Filed 2014·Granted Dec 20, 2016·1 cites·9 claims
- 0560US10196547B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·1 cites·13 claims
- 0647US10699933B2Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chipFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Jun 30, 2020·0 cites·1 claims
- 0746US10115707B2Adhesive film and semiconductor package using adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Oct 30, 2018·0 cites·13 claims
- 0845US10043996B2Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·17 claims
- 0945US2017152405A1Adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1042US2015017373A1Adhesive sheetFURUKAWA ELECTRIC CO LTD·Filed 2014·Application pending·0 cites
- 1140US10418267B2Method of processing a semiconductor wafer, semiconductor chip, and surface protective tapeFURUKAWA ELECTRIC CO LTD·Filed 2017·Granted Sep 17, 2019·0 cites·9 claims
- 1239US2014034532A1Dicing die bonding film packing structure and packing methodFURUKAWA ELECTRIC CO LTD·Filed 2013·Application pending·0 cites
- 1338US2016020423A1Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display deviceFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 1436US2016017197A1Element sealing resin composition for organic electronic device, element sealing resin sheet for organic electronic device, organic electroluminescence element, and image displayFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 1535US10196534B2Resin composition for sealing electronic device, and electronic deviceFURUKAWA ELECTRIC CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·13 claims
- 1635US2018190532A1Film for semiconductor back surfaceFURUKAWA ELECTRIC CO LTD·Filed 2018·Application pending·0 cites
- 1735US2017152418A1Maleimide filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1834US2017152411A1Conductive adhesive filmFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 1932US2016017186A1Sealant composition and sealing sheet obtained from the compositionFURUKAWA ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →