Inventor · disambiguated record
Hung-Hsin Liu
Also filed as: LIU HUNG-HSIN
8 granted patents·4 pending applications·30 citations·filing 2002–2013
81Inventor score
Files withTAIWAN SEMICONDUCTOR MFG6CHIPMOS TECHNOLOGIES INC2CHIPMOS TECHNOLOGIES BERMUDA1HON HAI PREC IND CO LTD1HUANG TZU HSIN1
Top patents by PatentIndex Score
12 records- 0166USD479200SCable end connector assemblyHON HAI PREC IND CO LTD·Filed 2002·Granted Sep 2, 2003·15 cites·1 claims
- 0257US6706601B1Method of forming tiny silicon nitride spacer for flash EPROM by using dry+wet etching technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 16, 2004·10 cites·41 claims
- 0346US8564954B2Thermally enhanced electronic packageHUANG TZU HSIN·Filed 2010·Granted Oct 22, 2013·1 cites·5 claims
- 0445US7180651B2Spacer fabrication process for manufacturing reflective stealth mirrors and other MEMS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Feb 20, 2007·1 cites·26 claims
- 0543US9307676B2Thermally enhanced electronic packageCHIPMOS TECHNOLOGIES INC·Filed 2013·Granted Apr 5, 2016·0 cites·20 claims
- 0641US7055532B2Method to remove fluorine residue from bond padsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 6, 2006·2 cites·18 claims
- 0737US6908813B2Method of forming tiny silicon nitride spacer for flash EPROM by fully wet etching technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 21, 2005·1 cites·28 claims
- 0836US2006199393A1H20 plasma and h20 vapor methods for releasing chargesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 0935US2006145315A1Flexible substrate for packageCHIPMOS TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 1035US2006145314A1Tape for tape carrier packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Application pending·0 cites
- 1132US2013069228A1Flip-chip package structure and forming method thereofLIU AN-HONG·Filed 2012·Application pending·0 cites
- 1228US6818555B2Method for metal etchback with self aligned etching maskTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 16, 2004·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →