Inventor · disambiguated record
Norihiko Sugie
Also filed as: SUGIE NORIHIKO
7 granted patents·4 pending applications·6 citations·filing 2006–2020
75Inventor score
Top patents by PatentIndex Score
11 records- 0175US8697344B2Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist patternJSR CORP·Filed 2013·Granted Apr 15, 2014·2 cites·6 claims
- 0263US8980529B2Radiation-sensitive resin composition, polymer, and resist pattern-forming methodJSR CORP·Filed 2013·Granted Mar 17, 2015·1 cites·9 claims
- 0358US8497062B2Resin for formation of upper antireflective film, composition for formation of upper antireflective film, and resist pattern formation methodNATSUME NORIHIRO·Filed 2008·Granted Jul 30, 2013·1 cites·4 claims
- 0457US8431332B2Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist patternKOUNO DAITA·Filed 2008·Granted Apr 30, 2013·1 cites·6 claims
- 0556US8895229B2Composition for formation of upper layer film, and method for formation of photoresist patternNISHIMURA YUKIO·Filed 2007·Granted Nov 25, 2014·1 cites·5 claims
- 0654US2014147794A1Method of forming photoresist patternJSR CORP·Filed 2014·Application pending·0 cites
- 0753US12104087B2Composition for chemical-mechanical polishing and chemical-mechanical polishing methodJSR CORP·Filed 2020·Granted Oct 1, 2024·0 cites·20 claims
- 0849US2012171613A1Upper layer film-forming composition and method of forming photoresist patternSUGIE NORIHIKO·Filed 2012·Application pending·0 cites
- 0940US2022389280A1Chemical mechanical polishing composition and chemical mechanical polishing methodJSR CORP·Filed 2020·Application pending·0 cites
- 1035US2006223001A1Radiation-sensitive resin compositionNISHIMURA ISAO·Filed 2006·Application pending·0 cites
- 1131US8501389B2Upper layer-forming composition and resist patterning methodKUSABIRAKI KAZUNORI·Filed 2011·Granted Aug 6, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →