Inventor · disambiguated record
Chaoyong Li
Also filed as: LI CHAOYONG
3 granted patents·18 citations·filing 2003–2007
67Inventor score
Files withAGENCY SCIENCE TECH & RES3
Top patents by PatentIndex Score
3 records- 0163US7335990B2Process of forming a composite diffusion barrier in copper/organic low-k damascene technologyAGENCY SCIENCE TECH & RES·Filed 2007·Granted Feb 26, 2008·3 cites·22 claims
- 0259US7244674B2Process of forming a composite diffusion barrier in copper/organic low-k damascene technologyAGENCY SCIENCE TECH & RES·Filed 2004·Granted Jul 17, 2007·10 cites·75 claims
- 0346US6872657B2Method to form copper seed layer for copper interconnectAGENCY SCIENCE TECH & RES·Filed 2003·Granted Mar 29, 2005·5 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →