Inventor · disambiguated record
Cynthia M. Melton
Also filed as: MELTON CYNTHIA · MELTON CYNTHIA M
24 granted patents·2,077 citations·filing 1990–1999
98Inventor score
Top patents by PatentIndex Score
24 records- 0197US6194250B1Low-profile microelectronic packageMOTOROLA INC·Filed 1998·Granted Feb 27, 2001·385 cites·12 claims
- 0295US5186383AMethod for forming solder bump interconnections to a solder-plated circuit traceMOTOROLA INC·Filed 1991·Granted Feb 16, 1993·152 cites·10 claims
- 0394US5844315ALow-profile microelectronic packageMOTOROLA CORP·Filed 1996·Granted Dec 1, 1998·216 cites·25 claims
- 0493US5269453ALow temperature method for forming solder bump interconnections to a plated circuit traceMOTOROLA INC·Filed 1992·Granted Dec 14, 1993·180 cites·14 claims
- 0592US5895229AMicroelectronic package including a polymer encapsulated die, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 20, 1999·128 cites·11 claims
- 0692US5320272ATin-bismuth solder connection having improved high temperature properties, and process for forming sameMOTOROLA INC·Filed 1993·Granted Jun 14, 1994·95 cites·17 claims
- 0791US6093972AMicroelectronic package including a polymer encapsulated dieMOTOROLA INC·Filed 1999·Granted Jul 25, 2000·125 cites·5 claims
- 0891US5410184AMicroelectronic package comprising tin-copper solder bump interconnections, and method for forming sameMOTOROLA INC·Filed 1993·Granted Apr 25, 1995·81 cites·6 claims
- 0991US5229070ALow temperature-wetting tin-base solder pasteMOTOROLA INC·Filed 1992·Granted Jul 20, 1993·79 cites·17 claims
- 1088US5154341ANoncollapsing multisolder interconnectionMOTOROLA INC·Filed 1990·Granted Oct 13, 1992·107 cites·4 claims
- 1186US5221038AMethod for forming tin-indium or tin-bismuth solder connection having increased melting temperatureMOTOROLA INC·Filed 1992·Granted Jun 22, 1993·63 cites·17 claims
- 1282US5814401ASelectively filled adhesive film containing a fluxing agentMOTOROLA INC·Filed 1997·Granted Sep 29, 1998·50 cites·23 claims
- 1381US5452842ATin-zinc solder connection to a printed circuit board or the likeMOTOROLA INC·Filed 1994·Granted Sep 26, 1995·47 cites·11 claims
- 1479US5282565ASolder bump interconnection formed using spaced solder deposit and consumable pathMOTOROLA INC·Filed 1992·Granted Feb 1, 1994·62 cites·12 claims
- 1578US5597110AMethod for forming a solder bump by solder-jetting or the likeMOTOROLA INC·Filed 1995·Granted Jan 28, 1997·58 cites·22 claims
- 1677US5390080ATin-zinc solder connection to a printed circuit board of the likeMOTOROLA INC·Filed 1993·Granted Feb 14, 1995·40 cites·8 claims
- 1777US5086966APalladium-coated solder ballMOTOROLA INC·Filed 1990·Granted Feb 11, 1992·41 cites·5 claims
- 1871US6436730B1Microelectronic package comprising tin copper solder bump interconnections and method for forming sameMOTOROLA INC·Filed 1996·Granted Aug 20, 2002·30 cites·5 claims
- 1970US5316205AMethod for forming gold bump connection using tin-bismuth solderMOTOROLA INC·Filed 1993·Granted May 31, 1994·31 cites·7 claims
- 2069US5429292ATin bismuth solder paste, and method using paste to form connection having improved high temperature propertiesMOTOROLA INC·Filed 1994·Granted Jul 4, 1995·27 cites·6 claims
- 2169US5233504ANoncollapsing multisolder interconnectionMOTOROLA INC·Filed 1992·Granted Aug 3, 1993·43 cites·4 claims
- 2265US5435838AImmersion plating of tin-bismuth solderMOTOROLA INC·Filed 1994·Granted Jul 25, 1995·22 cites·6 claims
- 2354US5389160ATin bismuth solder paste, and method using paste to form connection having improved high temperature propertiesMOTOROLA INC·Filed 1993·Granted Feb 14, 1995·14 cites·4 claims
- 2427US5391402AImmersion plating of tin-bismuth solderMOTOROLA INC·Filed 1993·Granted Feb 21, 1995·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →