Inventor · disambiguated record
Kailash C. Joshi
Also filed as: JOSHI KAILASH · JOSHI KAILASH C · JOSHI KAILASH CHANDRA
12 granted patents·1,020 citations·filing 1974–2003
95Inventor score
Top patents by PatentIndex Score
12 records- 0197US6657532B1Single and multi layer variable voltage protection devices and method of making sameSURGX CORP·Filed 1998·Granted Dec 2, 2003·90 cites·5 claims
- 0297US5807509ASingle and multi layer variable voltage protection devices and method of making sameSURGX CORP·Filed 1997·Granted Sep 15, 1998·136 cites·6 claims
- 0396US6542065B2Variable voltage protection structures and method for making sameSURGX CORP·Filed 2001·Granted Apr 1, 2003·118 cites·9 claims
- 0494US7049926B2Single and multi layer variable voltage protection devices and method of making sameSURGX CORP·Filed 2003·Granted May 23, 2006·65 cites·16 claims
- 0593US6239687B1Variable voltage protection structures and method for making sameSURGX CORP·Filed 1997·Granted May 29, 2001·122 cites·12 claims
- 0691US4069498AStudded heat exchanger for integrated circuit packageIBM·Filed 1976·Granted Jan 17, 1978·73 cites·11 claims
- 0789US6310752B1Variable voltage protection structures and method for making sameSURGX CORP·Filed 1997·Granted Oct 30, 2001·84 cites·5 claims
- 0889US6172590B1Over-voltage protection device and method for making sameSURGX CORP·Filed 1997·Granted Jan 9, 2001·123 cites·34 claims
- 0989US4179802AStudded chip attachment processIBM·Filed 1978·Granted Dec 25, 1979·78 cites·8 claims
- 1086US3999004AMultilayer ceramic substrate structureIBM·Filed 1974·Granted Dec 21, 1976·47 cites·9 claims
- 1183US6064094AOver-voltage protection system for integrated circuits using the bonding pads and passivation layerORYX TECHN CORP·Filed 1998·Granted May 16, 2000·76 cites·14 claims
- 1257US4180863AMagnetic domain device modular assemblyIBM·Filed 1978·Granted Dec 25, 1979·8 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →