Inventor · disambiguated record
Laurent-Luc Chapelon
Also filed as: CHAPELON LAURENT-LUC
22 granted patents·1 pending application·16 citations·filing 2011–2025
91Inventor score
Files withCHAPELON LAURENT-LUC6ST MICROELECTRONICS CROLLES 26ST MICROELECTRONICS CROLLES 2 SAS4ST MICROELECTRONICS SA3BOUCHOUCHA MOHAMED1
Top patents by PatentIndex Score
23 records- 0179US12218163B2Image acquisition deviceST MICROELECTRONICS CROLLES 2 SAS·Filed 2024·Granted Feb 4, 2025·0 cites·19 claims
- 0273US8896121B2Chip assembly systemST MICROELECTRONICS CROLLES 2·Filed 2013·Granted Nov 25, 2014·3 cites·6 claims
- 0369US10403682B2Phase-change memoryST MICROELECTRONICS CROLLES 2 SAS·Filed 2018·Granted Sep 3, 2019·1 cites·12 claims
- 0468US9136233B2Process for fabricating a three-dimensional integrated structure with improved heat dissipation, and corresponding three-dimensional integrated structureST MICROELECTRONICS CROLLES 2·Filed 2014·Granted Sep 15, 2015·2 cites·19 claims
- 0568US8980738B2Integrated circuit chip and fabrication methodCHAPELON LAURENT-LUC·Filed 2011·Granted Mar 17, 2015·3 cites·17 claims
- 0666US11948950B2Image acquisition deviceST MICROELECTRONICS CROLLES 2 SAS·Filed 2021·Granted Apr 2, 2024·0 cites·23 claims
- 0764US8673740B2Method for formation of an electrically conducting through viaCUZZOCREA JULIEN·Filed 2012·Granted Mar 18, 2014·3 cites·18 claims
- 0863US9093456B2Stack of semiconductor structures and corresponding manufacturing methodST MICROELECTRONICS CROLLES 2·Filed 2014·Granted Jul 28, 2015·1 cites·23 claims
- 0962US8907481B2Stack of semiconductor structures and corresponding manufacturing methodST MICROELECTRONICS CROLLES 2·Filed 2013·Granted Dec 9, 2014·1 cites·19 claims
- 1060US8890276B2Three-dimensional integrated structure capable of detecting a temperature riseST MICROELECTRONICS CROLLES 2·Filed 2013·Granted Nov 18, 2014·1 cites·19 claims
- 1159US9093505B2Integrated circuit chip and fabrication methodCHAPELON LAURENT-LUC·Filed 2011·Granted Jul 28, 2015·1 cites·15 claims
- 1255US9431373B2Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structureST MICROELECTRONICS SA·Filed 2014·Granted Aug 30, 2016·0 cites·16 claims
- 1355US2025261461A1Optical deviceST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 1451US9520334B2Integrated structure with improved heat dissipationST MICROELECTRONICS SA·Filed 2014·Granted Dec 13, 2016·0 cites·27 claims
- 1550US8916393B2Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structureST MICROELECTRONICS SA·Filed 2012·Granted Dec 23, 2014·0 cites·16 claims
- 1647US9455239B2Integrated circuit chip and fabrication methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2015·Granted Sep 27, 2016·0 cites·18 claims
- 1743US9293429B2Electronic chip comprising connection pillars and manufacturing methodCHAPELON LAURENT-LUC·Filed 2012·Granted Mar 22, 2016·0 cites·26 claims
- 1841US8860186B2Method for manufacturing an integrated circuit comprising vias crossing the substrateST MICROELECTRONICS CROLLES 2·Filed 2013·Granted Oct 14, 2014·0 cites·7 claims
- 1940US8466038B2Process for fabricating integrated-circuit chipsCHAPELON LAURENT-LUC·Filed 2011·Granted Jun 18, 2013·0 cites·21 claims
- 2039US8766381B2Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile elementCASSET FABRICE·Filed 2011·Granted Jul 1, 2014·0 cites·5 claims
- 2139US8674517B2Method of assembling two integrated circuits and corresponding structureCHAPELON LAURENT-LUC·Filed 2011·Granted Mar 18, 2014·0 cites·14 claims
- 2239US8518802B2Process for fabricating integrated-circuit chipsCHAPELON LAURENT-LUC·Filed 2011·Granted Aug 27, 2013·0 cites·13 claims
- 2331US8726736B2Method for determining the local stress induced in a semiconductor material wafer by through viasBOUCHOUCHA MOHAMED·Filed 2012·Granted May 20, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →