Inventor · disambiguated record
Oliver Humbel
Also filed as: HUMBEL OLIVER
13 granted patents·6 pending applications·9 citations·filing 2012–2025
84Inventor score
Top patents by PatentIndex Score
19 records- 0180US9355958B2Semiconductor device having a corrosion-resistant metallization and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 31, 2016·6 cites·22 claims
- 0275US2025331246A1Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0372US12183696B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 31, 2024·0 cites·25 claims
- 0470US8884342B2Semiconductor device with a passivation layerSCHMIDT GERHARD R·Filed 2012·Granted Nov 11, 2014·2 cites·30 claims
- 0568US11804415B2Semiconductor device with first and second portions that include silicon and nitrogenINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 0668US2023343726A1High Voltage Semiconductor Device with Step Topography Passivation Layer StackINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0767US12363961B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 15, 2025·0 cites·26 claims
- 0863US11764176B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 0960US11075134B2Semiconductor device with a portion including silicon and nitrogen and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 27, 2021·0 cites·24 claims
- 1060US10777506B2Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 15, 2020·0 cites·13 claims
- 1160US9418850B2Semiconductor device and method for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 16, 2016·1 cites·15 claims
- 1258US2021151391A1High Voltage Semiconductor Device with Step Topography Passivation Layer StackINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 1354US9859395B2Semiconductor device with a passivation layerINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 2, 2018·0 cites·36 claims
- 1452US10475743B2Semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 12, 2019·0 cites·25 claims
- 1551US2024194779A1Semiconductor device and method of producing thereofINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1644US9349799B2Adjusting the charge carrier lifetime in a bipolar semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 24, 2016·0 cites·37 claims
- 1741US11387359B2Ppower semiconductor device with anticorrosive edge termination structureINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 12, 2022·0 cites·20 claims
- 1841US2015262814A1Power semiconductor device,power electronic module, and method for processing a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 1940US2019333765A1Semiconductor Device and ManufacturingINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Oliver Humbel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →