Inventor · disambiguated record
Joachim Hirschler
Also filed as: HIRSCHLER JOACHIM
15 granted patents·4 pending applications·34 citations·filing 2012–2023
87Inventor score
Files withINFINEON TECHNOLOGIES AG14HIRSCHLER JOACHIM2DENIFL GUENTER1INFINEON TECHNOLOGIES AUSTRIA1INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
19 records- 0194US9673096B2Method for processing a semiconductor substrate and a method for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·22 cites·17 claims
- 0279US10195704B2Lift pin for substrate processingINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 5, 2019·6 cites·20 claims
- 0372US12183696B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 31, 2024·0 cites·25 claims
- 0468US9511560B2Processing a sacrificial material during manufacture of a microfabricated productDENIFL GUENTER·Filed 2012·Granted Dec 6, 2016·3 cites·16 claims
- 0568US8748307B2Use of a protection layer to protect a passivation while etching a waferHIRSCHLER JOACHIM·Filed 2012·Granted Jun 10, 2014·2 cites·19 claims
- 0663US11764176B2Semiconductor device including bonding pad metal layer structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 0760US8815706B2Methods of forming semiconductor devicesHIRSCHLER JOACHIM·Filed 2012·Granted Aug 26, 2014·1 cites·25 claims
- 0857US9135893B2Display deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 15, 2015·0 cites·13 claims
- 0954US9449928B2Layer arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·11 claims
- 1053US9905147B2Display deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 27, 2018·0 cites·12 claims
- 1151US10170746B2Battery electrode, battery, and method for manufacturing a battery electrodeINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jan 1, 2019·0 cites·24 claims
- 1250US9455192B2Kerf preparation for backside metallizationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 1348US2023082571A1Power semiconductor device and method of producing power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1445US11195713B2Methods of forming a silicon-insulator layer and semiconductor device having the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 7, 2021·0 cites·15 claims
- 1545US9614045B2Method of processing a semiconductor device and chip packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 4, 2017·0 cites·15 claims
- 1644US10453806B2Methods for forming semiconductor devices and semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Oct 22, 2019·0 cites·17 claims
- 1739US2014335700A1Carbon Layers for High Temperature ProcessesINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 1838US2014145345A1Method of forming a semiconductor structure, and a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 1930US2016204017A1Embrittlement device, pick-up system and method of picking up chipsINFINEON TECHNOLOGIES AUSTRIA·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Joachim Hirschler files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →