Inventor · disambiguated record
Thomas G. Ference
Also filed as: FERENCE THOMAS G · FERENCE THOMAS GEORGE
45 granted patents·7 pending applications·2,768 citations·filing 1992–2022
99Inventor score
Top patents by PatentIndex Score
52 records- 0199US5977640AHighly integrated chip-on-chip packagingIBM·Filed 1998·Granted Nov 2, 1999·585 cites·13 claims
- 0297US6271102B1Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 1998·Granted Aug 7, 2001·125 cites·11 claims
- 0397US5244143AApparatus and method for injection molding solder and applications thereofIBM·Filed 1992·Granted Sep 14, 1993·297 cites·35 claims
- 0496US6265771B1Dual chip with heat sinkIBM·Filed 1999·Granted Jul 24, 2001·209 cites·6 claims
- 0596US5926029AUltra fine probe contactsIBM·Filed 1997·Granted Jul 20, 1999·151 cites·11 claims
- 0694US5935763ASelf-aligned pattern over a reflective layerIBM·Filed 1996·Granted Aug 10, 1999·213 cites·18 claims
- 0793US6611050B1Chip edge interconnect apparatus and methodIBM·Filed 2000·Granted Aug 26, 2003·79 cites·16 claims
- 0893US6368881B1Wafer thickness control during backside grindIBM·Filed 2000·Granted Apr 9, 2002·54 cites·28 claims
- 0993US6294406B1Highly integrated chip-on-chip packagingIBM·Filed 1999·Granted Sep 25, 2001·120 cites·10 claims
- 1093US6231333B1Apparatus and method for vacuum injection moldingIBM·Filed 1995·Granted May 15, 2001·119 cites·20 claims
- 1193US5972765AUse of deuterated materials in semiconductor processingIBM·Filed 1997·Granted Oct 26, 1999·140 cites·35 claims
- 1292US6444490B2Micro-flex technology in semiconductor packagesIBM·Filed 2001·Granted Sep 3, 2002·45 cites·11 claims
- 1391US10088142B1LED light tubeLEDDYNAMICS·Filed 2016·Granted Oct 2, 2018·18 cites·22 claims
- 1490US6225699B1Chip-on-chip interconnections of varied characteristicsIBM·Filed 1998·Granted May 1, 2001·98 cites·32 claims
- 1586US6521977B1Deuterium reservoirs and ingress pathsIBM·Filed 2000·Granted Feb 18, 2003·30 cites·20 claims
- 1685US6887126B2Wafer thickness control during backside grindIBM·Filed 2001·Granted May 3, 2005·25 cites·14 claims
- 1783US6915795B2Method and system for dicing wafers, and semiconductor structures incorporating the products thereofIBM·Filed 2003·Granted Jul 12, 2005·20 cites·11 claims
- 1882US6221775B1Combined chemical mechanical polishing and reactive ion etching processIBM·Filed 1998·Granted Apr 24, 2001·64 cites·26 claims
- 1981US6534389B1Dual level contacts and method for formingIBM·Filed 2000·Granted Mar 18, 2003·34 cites·6 claims
- 2080US6858941B2Multi-chip stack and method of fabrication utilizing self-aligning electrical contact arrayIBM·Filed 2000·Granted Feb 22, 2005·25 cites·18 claims
- 2180US5903045ASelf-aligned connector for stacked chip moduleIBM·Filed 1996·Granted May 11, 1999·51 cites·27 claims
- 2279US7006234B1Common-path point-diffraction phase-shifting interferometer incorporating a birefringent polymer membraneINTERPHASE TECHNOLOGIES INC·Filed 2004·Granted Feb 28, 2006·22 cites·6 claims
- 2376US6517944B1Multi-layer passivation barrier for a superconducting elementTERACOMM RES INC·Filed 2000·Granted Feb 11, 2003·19 cites·16 claims
- 2476US6426241B1Method for forming three-dimensional circuitization and circuits formedIBM·Filed 1999·Granted Jul 30, 2002·39 cites·44 claims
- 2575US6642080B1Chip-on-chip interconnections of varied charactersticsIBM·Filed 2000·Granted Nov 4, 2003·18 cites·21 claims
- 2675US6300687B1Micro-flex technology in semiconductor packagesIBM·Filed 1998·Granted Oct 9, 2001·28 cites·32 claims
- 2771US9074859B1Marking cartridgeANZA CORP·Filed 2013·Granted Jul 7, 2015·3 cites·20 claims
- 2871US6770501B2Deuterium reservoirs and ingress pathsIBM·Filed 2002·Granted Aug 3, 2004·11 cites·17 claims
- 2971US6476956B1Fast optical modulatorTERACOMM RES INC·Filed 2001·Granted Nov 5, 2002·13 cites·53 claims
- 3070US5904502AMultiple 3-dimensional semiconductor device processing method and apparatusIBM·Filed 1997·Granted May 18, 1999·35 cites·15 claims
- 3165US2010005835A1Pearl containing cremated remainsJOHNSON SR RAYMOND KEITH·Filed 2009·Application pending·0 cites
- 3263US7407302B2Luminescent pop-up candyALLARD HARVEY CLOVIS·Filed 2005·Granted Aug 5, 2008·7 cites·29 claims
- 3363US6600213B2Semiconductor structure and package including a chip having chamfered edgesIBM·Filed 2001·Granted Jul 29, 2003·7 cites·8 claims
- 3462US6921018B2Multi-chip stack and method of fabrication utilizing self-aligning electrical contact arrayIBM·Filed 2003·Granted Jul 26, 2005·8 cites·14 claims
- 3560US6630426B1Method of increasing the critical temperature of a high critical temperature superconducting film and a superconducting structure made using the methodTERACOMM RES INC·Filed 2000·Granted Oct 7, 2003·5 cites·50 claims
- 3655US6813056B2High amplitude fast optical modulatorTERACOMM RES INC·Filed 2001·Granted Nov 2, 2004·4 cites·63 claims
- 3755US6429958B1Extinction ratio optical communication device using superconducting filmsTERACOMM RES INC·Filed 2001·Granted Aug 6, 2002·5 cites·92 claims
- 3854USD1033272SFlagFERENCE THOMAS GEORGE·Filed 2022·Granted Jul 2, 2024·1 cites·1 claims
- 3954US6380063B1Raised wall isolation device with spacer isolated contacts and the method of so formingIBM·Filed 2000·Granted Apr 30, 2002·6 cites·29 claims
- 4052US6030855ASelf-aligned connector for stacked chip moduleIBM·Filed 1999·Granted Feb 29, 2000·14 cites·11 claims
- 4151USD1025828SFlagFERENCE THOMAS GEORGE·Filed 2021·Granted May 7, 2024·1 cites·1 claims
- 4251US7134933B2Wafer thickness control during backside grindIBM·Filed 2005·Granted Nov 14, 2006·0 cites·8 claims
- 4350US6838749B2Structures for increasing the critical temperature of superconductorsTERACOMM RES INC·Filed 2003·Granted Jan 4, 2005·1 cites·12 claims
- 4450US2022358860A1Illuminated flagFERENCE THOMAS GEORGE·Filed 2022·Application pending·0 cites
- 4547US5793103AInsulated cube with exposed wire leadIBM·Filed 1997·Granted Aug 11, 1998·13 cites·12 claims
- 4646US2005161493A1Ultra-fine contact alignmentIBM·Filed 2005·Application pending·0 cites
- 4744US2005064697A1Ultra-fine contact alignmentIBM·Filed 2004·Application pending·0 cites
- 4842US6455778B2Micro-flex technology in semiconductor packagesIBM·Filed 2001·Granted Sep 24, 2002·0 cites·2 claims
- 4942US2005095011A1Method for high amplitude fast optical modulationFiled 2004·Application pending·0 cites
- 5041US2002068381A1Ultra-fine contact alignmentIBM·Filed 2001·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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