Inventor · disambiguated record
Eric J. M. Moret
Also filed as: MORET ERIC · MORET ERIC J · MORET ERIC J M
18 granted patents·14 pending applications·252 citations·filing 2008–2024
91Inventor score
Top patents by PatentIndex Score
32 records- 0194US8429403B2Systems and methods for provisioning network devicesMORET ERIC·Filed 2008·Granted Apr 23, 2013·231 cites·15 claims
- 0291US11808988B2Method and device for fast, passive alignment in photonics assemblyINTEL CORP·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 0385US9929031B2Methods and devices for securing and transporting singulated die in high volume manufacturingINTEL CORP·Filed 2016·Granted Mar 27, 2018·4 cites·22 claims
- 0484US9305816B2Methods and devices for securing and transporting singulated die in high volume manufacturingINTEL CORP·Filed 2013·Granted Apr 5, 2016·5 cites·21 claims
- 0581US9496161B2Methods and devices for securing and transporting singulated die in high volume manufacturingINTEL CORP·Filed 2016·Granted Nov 15, 2016·3 cites·22 claims
- 0677US12493151B2Method and device for fast, passive alignment in photonics assemblyINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0768US9279854B2Mechanism for facilitating modular processing cell framework and application for asynchronous parallel singulated semiconductor device handling and testingJOHNSON JOHN C·Filed 2012·Granted Mar 8, 2016·2 cites·20 claims
- 0868US8797053B2Positioning and socketing for semiconductor diceRUTIGLIANO MICHAEL L·Filed 2011·Granted Aug 5, 2014·3 cites·21 claims
- 0965US12411296B2Reworkable zero-force insertion electrical optical package socket and methodINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·23 claims
- 1065US9835679B1Systems, methods, and apparatuses for implementing fast throughput die handling for synchronous multi-die testingINTEL CORP·Filed 2016·Granted Dec 5, 2017·1 cites·25 claims
- 1163US11762157B2Method and system for attaching optical fibers to warped photonic chipsINTEL CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 1262US7960190B2Temporary package for at-speed functional test of semiconductor chipINTEL CORP·Filed 2008·Granted Jun 14, 2011·1 cites·13 claims
- 1359US2025291126A1Optical connectors with integrated optical isolatorsINTEL CORP·Filed 2024·Application pending·0 cites
- 1457US12506083B2Liquid metal interconnect for modular package server architectureINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·20 claims
- 1555US2025004220A1Photonic integrated circuit and optical coupler designs for improving process toleranceINTEL CORP·Filed 2023·Application pending·0 cites
- 1654US2024176167A1Integrated optical phase change materials for reconfigurable optics in glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 1754US2025004205A1Optical isolators for multi-channel optical interconnectsINTEL CORP·Filed 2023·Application pending·0 cites
- 1854US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1954US2025102745A1Robust waveguide alignment mechanismINTEL CORP·Filed 2023·Application pending·0 cites
- 2053US12494435B2Liquid metal interconnect for modular system on an interposer server architectureINTEL CORP·Filed 2021·Granted Dec 9, 2025·0 cites·22 claims
- 2153US10120018B2Adaptive thermal actuator array for wafer-level applicationsINTEL CORP·Filed 2016·Granted Nov 6, 2018·0 cites·25 claims
- 2253US2024094476A1Technologies for a pluggable optical connectorINTEL CORP·Filed 2022·Application pending·0 cites
- 2353US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 2453US2025110285A1ARCHITECTURES AND METHODS FOR ATTACHING PHOTONIC INTEGRATED CIRCUITS (PICs) TO OPTICAL CONNECTORSINTEL CORP·Filed 2023·Application pending·0 cites
- 2552US2024027697A1Pluggable optical connector with interfacial alignment featuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2651US12345931B2Optical circuit with optical port in sidewallINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 2751US12253901B2Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devicesINTEL CORP·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 2850US2024027706A1Photonics integrated circuit device packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 2950US2023314733A1Self-docking self-aligned optical pcb connector for semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3049US12135569B2Methods and apparatus to reduce thermal fluctuations in semiconductor processorsINTEL CORP·Filed 2020·Granted Nov 5, 2024·0 cites·25 claims
- 3149US2023087567A1Optical circuit with lens at substrate edgeINTEL CORP·Filed 2021·Application pending·0 cites
- 3248US2023187337A1Flexible liquid metal connection device and methodMeyyappan Karumbu·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →