Inventor · disambiguated record
Taegyeong Chung
Also filed as: CHUNG TAEGYEONG
4 granted patents·1 pending application·13 citations·filing 2009–2018
70Inventor score
Top patents by PatentIndex Score
5 records- 0178US10083846B2Apparatuses for bonding semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 25, 2018·2 cites·16 claims
- 0277US9704732B2Apparatuses for bonding semiconductor chipsHWANG YISUNG·Filed 2012·Granted Jul 11, 2017·5 cites·20 claims
- 0371US8051555B2Circuit manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·6 cites·25 claims
- 0457US10629461B2Apparatuses for bonding semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·8 claims
- 0530US2012031953A1Apparatus for bump reflow and methods of forming bumps using the samePARK MYEONG SOON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →