Inventor · disambiguated record
Yisung Hwang
Also filed as: HWANG YISUNG
5 granted patents·1 pending application·16 citations·filing 2012–2018
74Inventor score
Top patents by PatentIndex Score
6 records- 0184US9698117B2Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·8 cites·20 claims
- 0278US10083846B2Apparatuses for bonding semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 25, 2018·2 cites·16 claims
- 0377US9704732B2Apparatuses for bonding semiconductor chipsHWANG YISUNG·Filed 2012·Granted Jul 11, 2017·5 cites·20 claims
- 0458US9455165B2Die bonding deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 27, 2016·1 cites·20 claims
- 0557US10629461B2Apparatuses for bonding semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 21, 2020·0 cites·8 claims
- 0640US2014238618A1Die ejector and die separation methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →