Inventor · disambiguated record
Yueh-Ying Tsai
Also filed as: TSAI YUEH-YING
9 granted patents·5 pending applications·150 citations·filing 2001–2020
85Inventor score
Top patents by PatentIndex Score
14 records- 0191US6509636B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jan 21, 2003·84 cites·15 claims
- 0284US6424024B1Leadframe of quad flat non-leaded packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jul 23, 2002·61 cites·11 claims
- 0370US9190296B2Fabrication method of semiconductor package without chip carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 17, 2015·2 cites·18 claims
- 0466US11289409B2Method for fabricating carrier-free semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·12 claims
- 0562US8975734B2Semiconductor package without chip carrier and fabrication method thereofTSAI YUEH-YING·Filed 2010·Granted Mar 10, 2015·2 cites·19 claims
- 0660US8525336B2Semiconductor package and method of fabricating the sameLIN PANG-CHUN·Filed 2012·Granted Sep 3, 2013·1 cites·5 claims
- 0755US10566271B2Carrier-free semiconductor package and fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·13 claims
- 0851US9029203B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 12, 2015·0 cites·6 claims
- 0942US2016051415A1Dna collection kit and dna collecting method using the sameTCI GENE INC·Filed 2014·Application pending·0 cites
- 1042US2011298126A1Carrier-free semiconductor package and fabrication methodTSAI YUEH-YING·Filed 2010·Application pending·0 cites
- 1141US9257311B2Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 9, 2016·0 cites·8 claims
- 1241US2014239475A1Packaging substrate, semiconductor package and fabrication methods thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1338US2016140288A1Method for forming personal nutrition complex according to incidence of disease and genetic polymorphism by a prediction systemTCI GENE INC·Filed 2014·Application pending·0 cites
- 1438US2013009311A1Semiconductor carrier, package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →