Inventor · disambiguated record
Houko Sutou
Also filed as: SUTOU HOUKO
4 granted patents·4 citations·filing 2005–2012
63Inventor score
Files withKATOGI SHIGEKI4
Top patents by PatentIndex Score
4 records- 0161US8138268B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2005·Granted Mar 20, 2012·2 cites·13 claims
- 0259US8518303B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2006·Granted Aug 27, 2013·2 cites·15 claims
- 0351US8309658B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 0448US8696942B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →